Copper is a soft, ductile, lustrous metal with a pink hue that exhibits very high thermal and electrical conductivity.  Plating application of copper is commonly used as an underplating to enhance adhesion of deposits, improve electrical properties, impair migration of alloying elements into the final plated deposit or to improve corrosion resistance of the overall deposit.

As a final deposit, copper plating services are used for enhancing the brazing, thermal or electrical conductivity of substrate materials, as a high temperature lubricant, or as a heat treatment stop-off.  Copper can be plated matte to bright and with a wide range of deposit hardness and ductility.

All analytical and testing compliance is performed by the HPW in-house laboratory. Thickness and adhesion verification, solution analysis and hydrogen embrittlement relief are a sample of copper plating specification requirements. Inspection and testing are completed and documented for assurance of compliance to all specification and customer requirements.